​Applied Materials, Intel Partner on Next-Generation Chip Manufacturing Technology

Applied Materials is partnering with Intel to develop next-generation semiconductor manufacturing technologies.

​Applied Materials stated on October 6 that Intel has joined the Applied EPIC Center as a founding partner. The two companies will jointly research and develop process technologies and equipment across the front-end-of-line (FEOL), back-end-of-line (BEOL), and packaging stages of semiconductor manufacturing.

​The collaboration is aimed at supporting higher interconnect density, improved power delivery, and enhanced thermal performance for high-performance computing (HPC) platforms. HPC platforms refer to integrated computing systems designed to support workloads suited to agentic artificial intelligence (AI).

​The EPIC Center is a joint research and development facility for equipment and process innovation and commercialization being established in Silicon Valley. It aims to shorten the time required to commercialize semiconductor technologies, from the research stage to mass production.

​Specifically, the companies will collaborate on new materials for next-generation logic processes, device architectures, and advanced interconnect processes, as well as Foveros-based 3D-stacking packaging processes. Applied Materials will provide Intel with a dedicated secure space inside the EPIC Center. Intel will connect infrastructure at its research and development campus in Hillsboro, Oregon, with the EPIC Center.

​Gary Dickerson, chairman and chief executive officer (CEO) of Applied Materials, said, “Applied Materials and Intel have worked closely together for decades, pushing the boundaries of materials engineering to advance semiconductor technology.” He added, “With our teams working together at the EPIC Center, we will accelerate innovations in devices, interconnects, and packaging that will shape the future of AI computing.”

​Lip-Bu Tan, Intel CEO, said, “Intel is working closely with partners across the ecosystem to drive innovation in performance, power efficiency, and packaging as demand for AI computing grows.” He added, “We look forward to expanding our collaboration at the Applied EPIC Center and accelerating the path from research in the US to high-volume manufacturing.”

​The EPIC Center has more than 10 participating companies and organizations, including Samsung Electronics, SK hynix, Micron Technology, TSMC, and Broadcom. The facility is in the final stages of preparations for operations. Its opening ceremony is scheduled for October 12. A total investment of 7 trillion won will be made in stages.