Teradyne Brings Burn-In Testing to Titan HP for High-Power AI Chips

Teradyne has added enhanced burn-in capabilities to its Titan HP system-level test platform, targeting increasingly power-dense AI accelerators, cloud infrastructure processors and other high-reliability semiconductor devices. The production-ready system replaces the conventional model of stressing groups of chips inside temperature-controlled burn-in ovens with an approach that maintains each device at its target junction temperature while running realistic workloads.

The approach combines reliability stress and system-level testing on the same Titan HP platform. Teradyne says per-site thermal control can be tuned to the thermal and mechanical characteristics of individual devices, while high per-device kilowatt power delivery enables the system to test chips whose power consumption and heat dissipation are becoming difficult to accommodate using conventional burn-in flows. Each device can also retain its complete stress-and-test history in a single record.

Titan HP uses an asynchronous slot architecture, allowing each test site to load and operate independently. A long reliability test on one device therefore does not require other devices to wait for the same test cycle to complete, while individual sites can be serviced without stopping the entire system. Test programs run on Teradyne’s Atlas software platform and can be imported, newly created or ported across compatible Teradyne SLT systems. Teradyne says Titan HP with enhanced burn-in is available now and deployed in production.

Target Devices — High-power AI accelerators, cloud infrastructure silicon, automotive and other high-reliability devices

Burn-In Model — Runs realistic workloads while maintaining each device at its target junction temperature

Thermal Control — Per-site thermal control tailored to individual device thermal and force zones

Power — Kilowatt-class per-device power delivery, with a roadmap for higher future AI accelerator requirements

Architecture — Asynchronous slots allow devices to load and test independently and individual sites to be serviced while the system continues operating

Software — Teradyne Atlas for creating, importing and porting SLT programs

Availability — Available now and deployed in production

“Our customers are being asked to ship high-power AI silicon at reliability levels that used to belong to automotive,” said Jason Zee, vice president and general manager of Teradyne’s Integrated Systems Test division. Zee said moving reliability stress onto a system-level test platform can reduce test cost, improve time to market and provide better data on individual devices.

🌐 Analysis: AI Is Changing the Semiconductor Test Flow

Teradyne’s addition of burn-in to Titan HP reflects how AI accelerators are changing semiconductor reliability testing. Large AI devices increasingly combine high-power compute, HBM, chiplets and 2.5D/3D packaging, creating thermal and system-level failure modes that may not appear during conventional electrical testing. Instead of placing batches of devices in a common temperature-controlled oven, Titan HP can stress individual devices under realistic workloads while controlling their junction temperature. This brings reliability testing closer to actual operating conditions and applies reliability practices historically associated with automotive silicon to increasingly expensive AI accelerators.

The broader significance is the convergence of semiconductor test stages as AI devices become more complex and costly. Teradyne is positioning system-level test as a complement to wafer probe and package test, while integrating reliability stress onto the same platform could reduce dependence on separate burn-in equipment and provide a continuous device-level test history. Titan HP also fits Teradyne’s broader expansion across high-power AI chip testing, PCIe 6, silicon photonics/CPO and high-speed interconnect validation. As AI packages move toward kilowatt-class power envelopes, testing their electrical, thermal and functional behavior under realistic workloads is becoming a larger part of the manufacturing challenge.

Core Business — Automated semiconductor and electronics test equipment plus advanced robotics

AI Test Portfolio — UltraFLEXplus • Titan HP • Magnum • Photon 100 • MultiLane Test Products • Quantifi Photonics

Titan HP — High-performance system-level testing and reliability stress for high-power AI and cloud infrastructure devices

Strategic Direction — Extend test coverage across the AI device lifecycle from semiconductor manufacturing through increasingly system-level electrical, optical and reliability validation.

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