Chips & Supply · United States

ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool

Credited to Semiconductor Digest · semiconductor-digest.com · 26m ago

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China. The shipment marks another significant advance in ACM’s core panel-level technologies and represents an important step forward in broadening its multi-product platform and expanding its global customer presence.

As advanced packaging technologies continue to evolve, panel-level processing is gaining traction across the industry for its ability to accommodate larger substrates. Electroplating is one of the most critical steps in advanced packaging manufacturing, where equipment stability, plating thickness uniformity and consistency are essential to successful process integration, product yield and manufacturing efficiency. The newly shipped tool is designed for 310 × 310 mm panel-level applications, and demonstrates ACM’s ability to quickly advance product development per customer requirements. This follows last year’s shipment of ACM’s first 515 × 510 mm R&D tool, highlighting ACM’s ability to rapidly commercialize technical breakthroughs into scale production.

“This is an important milestone for ACM’s advanced packaging efforts, and marks shipment of what we believe is the world’s first 310 × 310 mm panel-level horizontal electroplating production tool to a customer in Asia,” said Dr. David Wang, President and Chief Executive Officer of ACM Research. “We believe our proprietary horizontal plating technology is uniquely positioned to enable the next generation of advanced semiconductor packaging across multiple panel sizes and emerging packaging architectures. As AI drives increasingly complex packaging requirements, we see a significant long-term opportunity for ACM to play an enabling role in this rapidly evolving market.”

The Ultra ECP ap-p system features ACM’s proprietary horizontal electroplating technology and supports copper (Cu), nickel (Ni), tin-silver (SnAg) and gold (Au) plating processes. Its copper plating chamber incorporates a high-speed plating paddle specifically designed for tall copper pillar applications, capable of achieving good within-die uniformity for 300-micron copper pillars at high plating rates. The system also features a four-sided sealing dry contact chuck for improved reliability, in-cell rinse functionality to minimize chemical cross-contamination between different plating cells, and a horizontal electroplating design that uses ACM’s patent-pending technology to synchronize the rotation of the chuck with a rotating rectangular electric field for superior deposition uniformity.

Beyond equipment delivery, ACM is committed to building long-term customer relationships by providing high-quality equipment, supporting reliable volume production and delivering reliable technical support. ACM will continue to advance its technologies, expand its multi-product platform and grow its global customer base. Through collaboration with partners worldwide, ACM aims to support the growth of the AI industry and create greater value for customers with its differentiated semiconductor equipment technologies.

Chips & SupplyUnited States

Accepting Orders for the LED Light-Sourced Projection Aligners

Credited to EE Times · eetimes.com4h ago

Useful

The UX-4 series is a full-field projection aligner that has a proven track record over many years as lithography equipment that enhances production efficiency, primarily for power semiconductors, MEMS sensors, and devices related to communication and photoelectronic fusion (optical semiconductors) In recent years, environmental regulations concerning the use and emission of chemical substances have tightened in the semiconductor industry, impacting the entire sector. Against this backdrop, adoption of LED light sources in lithography equipment has been progressing. However, extending exposure times due to insufficient intensity remains a challenge for layers requiring a high exposure dose.

To address this challenge, based on the solid-state light source design technologies cultivated since its founding, Ushio developed an LED light source unit that achieves intensity equivalent to conventional mercury lamps and has successfully developed the UX-44101SCB and UX-45114SCB, incorporating this LED light source unit. As next-generation electronic devices essential to the evolution of IoT, 5G, and mobility drive the demand for larger wafer sizes and higher-precision layers, even processes requiring high exposure dose—such as Bump ※1 and WLP ※2 can achieve high throughput equivalent to conventional mercury lamp equipment.

In addition, compared with conventional mercury lamps, the equipment enables instantaneous turn-on and turn-off during exposure, thereby extending the lifetime of the light source and significantly reducing running costs after installation. As a leading company in full-field projection aligners for wafers, Ushio will continue to contribute to the realization of a convenient and comfortable society through light. ※1 A process to form microscopic bump-shaped metal terminals called “bumps” (such as solder balls) on the electrode parts of semiconductor chips. ※2 A process to perform batch packaging (encapsulation) and terminal formation on the whole wafer before cutting the silicon wafer into square chips.

Main Features

・ Full-field projection exposure: No Mask damage, High productivity of 120 WPH or more ・Deep depth of focus: Exposure to 3D surface shapes, thick-film resist exposure ・Automation compatible: Inline, Online, OHT/AGV ・Mercury-free: Compatible with LED light sources

Specifications

Specifications/Model — UX-44101SCB; UX-45114SCB (Provisional specifications); UX-45114SC (Lamp Light Source)

Supported wafer materials — Si, GaAs, GaN, GaP, InP, SiC, Glass, Sapphire, Ceramics, LN, LT, Thin & Thick

Automation Options — EFEM, Automatic mask handling, SECS/GEM online, AGV, Inline with coater/developer

*Appearance and specifications are subject to change without prior notice.

For further information, please check the website below.

Mask aligner UX-4 Series (Full Field Projection) | Ushio Inc.

Ushio Inc. Photolithography Division Sales and Marketing Department

Please use the online inquiry form on our website.

Original · EE Times

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Chips & Supply · United States

Hanmi Semiconductor, Hanwha Semitech Agree to Mediate TC Bonder Patent Dispute

Credited to TheElec · thelec.net · 1h ago

A patent dispute between Hanmi Semiconductor and Hanwha Semitech over thermocompression (TC) bonding equipment used to manufacture high-bandwidth memory (HBM) will be put on hold as the companies pursue mediation.

A Hanwha Semitech official said on November 3 that the two companies had agreed to enter mediation proceedings before the Industrial Property Rights Dispute Mediation Committee, following a recommendation from the Intellectual Property Trial and Appeal Board last month.

"We will participate in the mediation process in good faith," the official said. The company declined to disclose details, including the mediation schedule.

A Hanmi Semiconductor official also said the company had followed the court's recommendation in accordance with customary practice.

The Industrial Property Rights Dispute Mediation Committee is a body that seeks to resolve disputes involving patents and other intellectual property rights through agreements between the parties. It operates under the Ministry of Intellectual Property to reduce the time and costs associated with litigation.

During mediation, a panel of experts hears arguments from both sides and seeks to broker a settlement. The process can address multiple types of disputes, including civil and criminal litigation and patent proceedings. Unless exceptional circumstances arise, mediation is generally completed within three months of an application. Proceedings are confidential.

A successful mediation carries the same legal effect as a court settlement. If mediation fails, the parties can resume litigation.

Hanmi Semiconductor and Hanwha Semitech had originally been scheduled to attend their fourth hearing at the Seoul Central District Court in Seocho, Seoul, on November 3. The hearing was postponed after Hanwha Semitech, the plaintiff, filed a request to change the hearing date the previous day. The companies plan to resume the trial after mediation.

The patent dispute began in December 2024, when Hanmi Semiconductor filed a lawsuit against Hanwha Semitech alleging infringement of its TC bonder patents. Hanwha Semitech subsequently filed a countersuit, claiming that Hanmi Semiconductor's Griffin and Dragon TC bonders infringed its patents and seeking measures including the disposal of the equipment.

Hanwha Semitech alleges that Hanmi Semiconductor infringed three of its patents covering flux application inspection technology, blue-light inspection methods and flux planarization technology. Flux is a material used in the semiconductor chip bonding process. TC bonders are critical equipment for HBM manufacturing, stacking and bonding DRAM dies vertically.

Hanmi Semiconductor has rejected Hanwha Semitech's allegations in their entirety. It maintains that the companies use different light-source wavelengths and defect-detection methods for flux inspection, and that their planarization technologies also differ.