Capital · United States

Tech sector pours $2.4B in AI tools, compute credits for Genesis Mission Consortium

Credited to FedScoop · fedscoop.com · 3h ago

Technology companies are putting more money into the Genesis Mission, according to a White House announcement Thursday.

The 11 partners have committed $2.4 billion in AI tools and compute credits for the Genesis Mission Consortium, which is supposed to serve as a collaborative hub for public-private partnership through working groups and other avenues.

Nvidia is investing the most resources with a tab of $1 billion, followed by AMD’s $500 million commitment and OpenAI’s $200 million investment. Anthropic and Google are also putting capital towards the consortium.

The Department of Energy has leaned heavily on private-sector partners to advance its Genesis Mission goals, which include creating an AI-powered national platform.

The consortium was established in February as a way to facilitate “ pooled expertise and co-creation efforts.” Its ranks have continued to grow as the Genesis Mission has broadened to include more than a dozen federal agencies.

In addition to the consortium, securing private-sector partners was a requirement for large team applications to a Genesis Mission funding opportunity that totalled $293 million. Industry partners were also encouraged for small team applications, but not required. Even so, more companies were part of the initial 278 team-based awards announced this summer than any other group, such as universities, national labs and nonprofit organizations.

The latest private-sector investments were unveiled by the White House alongside other science initiatives, such as a DOE and National Science Foundation investment in autonomous laboratories.

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NVIDIA balances at $230 support on 5h chart: Live levels

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Capital · United States

GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components

Credited to Semiconductor Digest · semiconductor-digest.com · 2h ago

Home » GlobalFoundries, TSMC Strike $2B Deal for U.S. AI Chip Packaging Components

GlobalFoundries (Nasdaq: GFS) (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems. The agreement provides a foundation to expand capacity over time as customer demand grows.

GF expects to expand capacity at its Malta facility and establish the first U.S.-based source of silicon interposers supporting advanced packaging technologies, including embedded deep trench capacitor components. The additional manufacturing capacity will provide greater scale and flexibility for delivering advanced packaging solutions across multiple product generations.

“Advanced packaging is becoming increasingly critical to delivering the performance, power efficiency and scale required for next-generation AI systems,” said Ed Kaste, senior vice president of CMOS Business at GF. “By providing manufacturing service using GF’s trusted U.S. manufacturing footprint, we are creating a secure, scalable source of essential advanced-packaging elements that will help customers accelerate innovation and strengthen the semiconductor supply chain.”

Volume production is expected to begin ramping at GF’s Malta site during the first half of 2028. The agreement has an initial term of five years and provides a framework for future capacity expansion.

Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.