Chips & Supply · United States

HPE launches four new AMD-powered servers as part of its ProLiant Gen13 portfolio

Credited to Data Center Dynamics · datacenterdynamics.com · 10h ago

Photograph · Data Center Dynamics

Will expand compute, memory, and I/O capabilities across a number of different workloads

HPE has introduced four new AMD-powered servers to its ProLiant Gen13 portfolio.

Featuring sixth-generation AMD Epyc CPUs, HPE said the new systems will expand compute, memory, and I/O capabilities to accelerate agentic AI, inference, analytics, virtualization, and simulation workloads.

The HPE ProLiant DL585a Gen13 Server has been designed to support up to eight double-wide PCIe GPUs and two sixth-generation AMD Epyc CPUs, connected by PCIe Gen6 technology. The server “maximizes GPU utilization, token throughput, and PCIe bandwidth” across every layer to support demanding workloads, HPE said.

Meanwhile, the HPE ProLiant DL525 Gen13 Server is described as a “compact, performance-optimized” system with a 1U, single-socket design. Powered by a single sixth-generation AMD Epyc CPU, with up to 256 cores, it also offers high-bandwidth 16-channel memory, with support for DDR5 and MRDIMM architectures, and PCIe Gen6 connectivity. HPE said this makes the server ideal for workloads with “extremely high data throughput,” such as electronic design automation, simulation, and AI inference.

For large-scale, compute-intensive applications, HPE has developed the HPE ProLiant XD245 Gen13 and XD285 Gen13. According to the company, the OCP-compliant systems “combine high-density compute with efficient shared power and cooling to support data-intensive AI and HPC workloads.”

The XD245 has a one-Open Rack Unit (1OU), four-node direct liquid-cooled design, and is powered by up to eight sixth-generation AMD Epyc CPUs, while the XD285 has a two-Open Rack Unit (2OU), two-node air-cooled design, making it suited to a broader range of data center environments.

“Organizations need to turn their investments in agentic AI and inference into business value without adding operational complexity or risk,” said Krista Satterthwaite, SVP and GM, compute, at HPE. “For these workloads, HPE ProLiant Gen13 brings together optimized performance, built-in, automatic security, intelligent operations, and proven reliability. It gives customers a trusted foundation to modernize and innovate today and adapt as their requirements evolve.”

Dan McNamara, SVP and GM, compute and enterprise AI, AMD, added: “AI is moving into the applications and operations that run the enterprise, fundamentally changing what organizations demand from their infrastructure. Across generations of AMD Epyc CPUs and HPE ProLiant servers, our teams have worked side by side to turn advances in processor and system design into practical value for customers. With sixth-generation AMD Epyc processors and HPE ProLiant Gen13, we are delivering the performance, efficiency, and flexibility enterprises need to scale AI while modernizing the critical workloads their businesses depend on.”

The HPE ProLiant DL525 Gen13 server will be available later this year, while the HPE ProLiant DL585a Gen13 server will be available in early 2027. The HPE ProLiant XD245 and XD285 Gen13 servers will be available in 2027.

Chips & SupplyUnited States

Former Google, Nvidia Execs Launch Company to Ease GPU Crunch

Credited to The Information$ · theinformation.com11h ago

Useful

Anjney Midha, a former general partner at Andreessen Horowitz, and former executives at Google, Apple and Nvidia have launched a company that aims to make it easier and more affordable for smaller companies or startups to access such compute. The move comes as Microsoft and…

View the article · $The Information

Front Method

Chips & Supply · United States

From Electrification to Architecture: The Next Automotive Era

Credited to EE Times · eetimes.com · 10h ago

Photograph · EE Times

How software-defined vehicles are reshaping system integration and semiconductor requirements

Perspective: As vehicle architectures become more centralized and software-driven, packaging, test, qualification and manufacturing execution become increasingly important to system performance and reliability.

The automotive industry is undergoing a fundamental transformation. Electrification has already reshaped the vehicle, but a second shift is now underway. It is less visible, yet just as significant: vehicle architecture is changing.

Electric vehicles have significantly increased the role of semiconductors across power electronics, charging systems, sensing and protection. These components now sit at the core of how vehicles operate.

The next phase goes beyond electrification. Automakers are moving toward software-defined vehicles, where software plays a central role in coordinating functions and enabling updates throughout the vehicle lifecycle.

Traditionally, vehicles relied on distributed architectures with numerous electronic control units, each handling a specific function. Over time, this created more components, more wiring and greater integration complexity.

The industry is now shifting toward more centralized or zonal architectures, where fewer, more powerful computing platforms manage multiple functions.

This does not eliminate complexity. It changes where complexity sits:

In short, hardware becomes more integrated while the overall system becomes more software-driven.

Despite these architectural changes, several fundamentals remain unchanged:

These functions continue to support semiconductor demand as vehicle electrification advances.

While the core building blocks remain, the requirements around them are increasing:

As vehicle architectures evolve, chip performance alone is not enough. Success increasingly depends on how semiconductor devices are packaged, tested, qualified and manufactured at scale.

Automotive-grade devices must meet stringent reliability requirements. Qualification involves extensive stress testing to help ensure dependable performance under real-world operating conditions.

For semiconductor companies and automotive system providers, this evolution increases the value of working with assembly and test partners that can address integration, thermal performance, qualification and manufacturing consistency from development through volume production.

Electrification increased semiconductor content across the vehicle. Software-defined and centralized architectures are now changing how that content is integrated, managed and scaled.

For the semiconductor value chain, the implication is clear: greater system integration must be matched by stronger packaging, test, qualification and manufacturing execution.

Electrification started the change. Architecture will define what comes next.

Learn more about UTAC’s automotive semiconductor assembly and test capabilities.

UTAC Group provides semiconductor assembly and test solutions across automotive, industrial, consumer, communications and other high-reliability applications. Leveraging a broad portfolio of packaging, test and manufacturing capabilities, UTAC Group supports customers from wafer sort through assembly, test and qualification across a wide range of semiconductor devices.