Chips & SupplyEurope

ASML patents point to a hybrid bonder as chip toolmakers crowd into packaging

Credited to DigiTimes$ · digitimes.com

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As it becomes harder and costlier to shrink transistors, advanced packaging has become the place chip equipment makers look to for their next leg of growth, and ASML appears to be preparing its second move into it. Patent filings analyzed by research firm SemiAnalysis suggest…

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