TSMC supplier Gudeng launches operations at Arizona plant

Wafer and packaging handling solutions provider Gudeng Precision Industrial Co (家登精密) on Tuesday officially launched operations at its plant in Arizona, following the establishment of a production base in the state by contract chipmaker Taiwan Semiconductor Manufacturing Co (TSMC, 台積電).

Presiding over a ceremony to celebrate the official completion of the new plant in Arizona, Gudeng chairman Bill Chiu (邱銘乾) said it marked a critical step in the company’s global expansion amid the restructuring of global supply chains.

Gudeng, which has production bases in Taiwan, China and South Korea, also broke ground for a plant in the Kurume-Hirokawa New Industrial Park in Fukuoka Prefecture, Japan, on April 15 last year.

Gudeng Precision Industrial Co chairman Bill Chiu, center, and other guests attend a launch ceremony of the company’s Arizona plant on Tuesday.

Photo Courtesy of Gudeng Precision Industrial Co

Arizona was selected for Gudeng’s overseas production base because the state, where TSMC operates an advanced wafer fab and plans to build additional facilities, including advanced chip packaging plants, has developed a comprehensive cluster covering the semiconductor and aerospace industries, Chiu said.

Chiu also praised Arizona for its large talent pool and the state government’s long-term support for advanced manufacturing and technological innovation.

By taking advantage of its Arizona production site, Gudeng expects to provide better services to customers in the US market and grow alongside its customers, Chiu said.

Gudeng would leverage its Arizona location to establish an initial parts-processing production line, the company said.