Chips & Supply · United States

JNTC Added to Nvidia’s Glass Substrate Supplier List

Credited to TheElec · thelec.net · 12h ago

JNTC has been registered as a supplier of through-glass via (TGV) glass substrates to Nvidia.

Nvidia is JNTC’s second major US semiconductor customer after Broadcom. The company has been confirmed to be supplying paid samples of TGV glass substrates, including 2mm-thick glass cores.

According to industry sources on Nov. 6, JNTC was added to Nvidia’s approved supplier list in October 2026, about a month after their initial contact in September 2026. Nvidia representatives also reportedly visited JNTC’s headquarters to discuss product specifications and potential project applications.

Supplier registration is a process through which a customer establishes a purchasing account and payment system to buy products from a supplier that has passed initial quality verification. TGV glass substrate evaluations typically begin with customers requesting one to five free samples. After several rounds of free evaluations involving specification adjustments, the process advances to larger-volume paid evaluations once basic reliability has been confirmed.

Larger-volume evaluations assess whether suppliers can maintain consistent quality and yields during repeated production runs. Supply volumes range from several hundred to several thousand substrates per order. Substrate manufacturers or outsourced semiconductor assembly and test (OSAT) providers then conduct reliability evaluations after build-up and chip mounting processes.

The samples supplied to Nvidia include JNTC’s 2mm-thick TGV glass substrates, which the company completed developing in June 2026. The substrates undergo microhole formation in 2mm-thick glass, followed by etching, metallization and chemical mechanical polishing (CMP). The products reportedly showed no microcracks even after copper was chemically removed following metallization.

Peel strength, which measures the adhesion between glass and copper inside the vias, reportedly reached approximately 0.8 kgf/mm, twice the industry requirement of 0.4 kgf/mm. Insufficient adhesion can cause microcracks around the vias after metallization or lead to glass tearing during singulation into individual chips following the build-up process.

JNTC is developing TGV glass substrates for Broadcom in cooperation with Japan’s Toppan. The company is currently developing TGV glass substrates under nondisclosure agreements (NDAs) with 30 companies, including substrate manufacturers, OSAT providers and semiconductor companies. About 10 of these customers have advanced to the paid-sample stage.

JNTC posted an operating loss of 78 billion won in 2025 and 36.4 billion won in the first half of 2026 as revenue from its core mobile cover glass business declined. Revenue from glass substrates has not yet been reported separately.

JNTC plans to meet customer sample demand through its pilot line in Hwaseong until 2027. The company intends to begin building a production line in Gimcheon in the second half of 2027 and start supplying initial mass-production volumes in mid-2028.

“We cannot disclose information regarding our customers,” a company official said.

Chips & SupplyUnited States

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