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Scaling 3D IC design: Trends, Challenges and Practical Workflows

Credited to EE Times · eetimes.com · 15h ago

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Available Exclusively On Demand

3D IC architectures are enabling the next generation of AI, HPC, and advanced semiconductor systems – but scaling these designs introduces new challenges across heterogeneous integration, die-to-die connectivity, thermal behavior, power delivery, and system-level verification.

In this webinar, an industry analyst from Futurum Group will share insights into the latest 3D IC market trends, adoption drivers, and design challenges. Siemens experts will then provide an overview of the Innovator3D IC solution, followed by a workflow demonstration showing how teams can support early architecture exploration, die-package-system co-design, and integrated 3D IC planning.

Join this session to hear an expert industry perspective from Futurum Group and see how Siemens Innovator3D IC enables scalable, efficient 3D IC design workflows from early planning through implementation.

RELATED TOPICS: 3D IC, HIGH PERFORMANCE COMPUTING (HPC)